Recently, UIGreen made a wonderful appearance at the 2025 SEMI China South Summit and successfully completed the speech and exchange session. During the summit, UIGreen exchanged ideas with many industry elites and discussed the new developments and future trends of the semiconductor industry.

At the "SEMI China Semiconductor Advanced Test Technology Forum ", Cai Hongyi, Director of Design and R&D at UIGreen's Micro Testing Division, elaborated on the topic "The 'Golden Combination' for High-Speed Chip Testing: Coaxial Probe Impedance Matching and High-Density Test Socket", demonstrating the company's strength in driving the development of the semiconductor industry with innovative testing technologies.

We would like to thank the SEMI China South Summit for providing a platform for in-depth communication and joint development with industry partners. UIGreen looks forward to continuing cooperation with industry peers to create a better future.