With the successful conclusion of ICCAD-Expo 2024, UIGreen was honored to exchange product information and discuss the development trends of the semiconductor industry with many peers.

In the forum “ICCAD-Expo 2024 Advanced Packaging and Testing (II)”, Cai Hongyi, the R&D Director of UIGreen Micro Testing Division, deeply elaborated on the application of UIG Z Series Contact in RF Chip Testing, showcasing UIGreen's excellent testing technology and solutions.

During the exhibition, UIGreen actively communicated with many industry partners and potential customers, discussing the latest trends and potential cooperation opportunities in the industry. Innovative achievements of UIGreen in the semiconductor field were also showcased and gained the attention of many visitors.

UIGreen would like to express sincere gratitude for the networking opportunities provided by ICCAD-Expo 2024, which gave us the chance to have in-depth communication with industry partners. UIGreen hopes to join hands with more industry colleagues in future events to create brilliance together and looks forward to meeting again.